Methods for forming banks and organic thin film transistors comprising such banks

ABSTRACT

Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.

PRIORITY STATEMENT

This non-provisional application claims priority under 35 U.S.C. §119(a)from Korean Patent Application No. 2006-15715, which was filed on Feb.17, 2006, which is herein incorporated, in its entirety, by reference.

BACKGROUND OF EXAMPLE EMBODIMENTS

1. Field of Endeavor

Example embodiments relate to methods for forming banks for retainingliquids and other flowable materials and organic thin film transistorsincluding such banks. More specifically, example embodiments relate tomethods for forming banks during the fabrication of organic electronicdevices by utilizing a printing technique wherein a mixture of awater-soluble polymer containing a UV curing agent and a water-solublefluorine compound is used to perform the formation and surface treatmentof banks substantially simultaneously, and organic thin film transistorscomprising such banks.

2. Description of Related Art

In recent years, a variety of polymeric materials have been investigatedfor their potential as novel electrical and electronic materialssuitable for a wide variety of applications, e.g., functional electronicand optical devices. Polymeric materials may provide one or moreadvantages over previous materials including, for example, the relativeease with which they can be molded into fibers and films, improvedflexibility, increased conductivity and reduced production costs.Research relating to electrically conductive polymers and their use infabricating semiconductor active regions for organic thin filmtransistors has been ongoing for at least about 25 years.

Organic thin film transistors can be fabricated using relatively simpleprocesses, such as printing, at relatively low cost. In addition,advantages associated with organic thin film transistors includerelatively simple processes and their generally good compatibility withflexible substrates. In light of these advantages, a number of studieson organic thin film transistors are now ongoing around the world.Indeed, it is anticipated that organic thin film transistors will beparticularly be useful in fabricating driving devices for activedisplays and in fabricating plastic chips that may, in turn, beincorporated into smart cards and/or inventory tags, for example RFIDproducts.

However, the use of liquid or other flowable materials for formingand/or filling thin film patterns during the fabrication of organicelectronic devices, such as display devices (e.g., electroluminescence(EL) devices and light-emitting diodes (LEDs)), in combination withconventional printing techniques can result in containment failures. Forexample, the liquid material(s) may overflow the bank and spread intothe pixel regions of adjacent organic electronic devices, therebydegrading the properties of the affected electronic devices. Forexample, when a photoresist composition is used to form banks using anorganic solvent in the fabrication of a bottom contact type or top gatetype organic thin film transistor, overflow of the organic solvent cancompromise the dielectric performance of adjacent organic insulatingfilms, thereby potentially degrading the performance of the resultingorganic thin film transistor.

As used herein, the term “bank” should be understood as referring toretaining structures, isolation structures, dams or partition members,i.e., structures configured to divide adjacent regions and suppress orprevent cross-talk between adjacent devices and/or to define enclosedregions that can subsequently be filled with a liquid or other flowablecomposition, for example, a suitable ink, to define discrete functionalzones or regions on the surface of the device and improve the uniformityof the resulting device structure(s).

Many methods have been utilized in efforts to address the processingissues associated with the conventional formation and utilization ofsuch banks. One such effort resulted in a method for forming bankscomprising forming a polyimide layer, forming a photoresist layer on thepolyimide layer, baking the layers, exposing the baked layers to apattern of UV radiation during a photolithographic exposure process,developing the exposed photoresist layer to from a photoresist patternand etching the exposed regions of the polyimide layer. This method alsoprovided for post-etch surface treatment of the banks to alter thecontact angle between the banks and the substrate on which they wereformed. Another effort resulted in a method for forming banks comprisingthe steps of forming a layer of a polymer compound on a substrate,stamping the polymer layer, and baking the stamped layer. This methodalso provided for a surface treatment of the banks with plasma to modifythe initial structure.

These conventional methods, however, remain generally unsuited forfabrication processes that include bottom gate type insulating films,which are general structures of display arrays that are, in turn, usedto fabricate organic devices. In the fabrication of such devices, theorganic devices are exposed to organic solvents and may be degraded as aresult of this exposure. In particular, the solvent(s) and/or solventsystems present in the compositions utilized for forming the banks, forexample, the photoresist solvent(s), developing solvents and photoresiststripping compositions can degrade the underlying and/or previouslypatterned organic materials which, in turn, can degrade the yield,performance and/or reliability of the resulting devices.

SUMMARY OF EXAMPLE EMBODIMENTS

The example embodiments, therefore, have been devised in light of thedeficiencies and compromises associated with the conventional methodsfor fabricating such banks and the devices that incorporate such banks.Example embodiments, for example, include methods example embodimentsfor forming banks during the fabrication of organic electronic devicesutilizing a printing technique that suppresses or eliminates adverseeffects in adjacent organic electronic devices, for example, the pixelregions of adjacent devices and/or structural modules. Accordingly,methods according to example embodiments provide for the fabrication ofbanks sufficient to suppress or eliminate degradation of adjacentregions while still providing a degree of control with respect to therelative hydrophilicity of channel regions and/or other selectedregions, thereby suppressing or preventing organic solvents fromoverflowing the banks.

Example embodiments also include methods for fabricating organic thinfilm transistor devices, for example, display drivers and/or displaydevices, that incorporate banks formed using one or more methodsaccording to example embodiments for fabricating banks sufficient tosuppress or eliminate degradation of adjacent regions and to provide adegree of control of the relative hydrophilicity of channel regionsand/or other selected regions to improve containment of organic solventswithin the banks. Example embodiments also include electronic displaydevices incorporating one or more such display devices that, in turn,incorporate banks formed using one or more methods according to exampleembodiments for fabricating banks capable of suppressing or eliminatingdegradation of adjacent regions by providing a degree of control of therelative hydrophilicity of channel regions and/or other active regions.

One method in accord with example embodiments for achieving the desiredimprovement in the performance of the banks includes fabricating anorganic electronic device using a printing technique employing a mixtureof a water-soluble polymer containing a UV curing agent and awater-soluble fluorine compound for achieving formation and surfacetreatment of banks in a substantially simultaneous fashion.

BRIEF DESCRIPTION OF THE DRAWINGS

The features, elements and steps according to example embodiments willbe more clearly understood from the following detailed description whenconsidered in light of the accompanying drawings, in which:

FIG. 1 is a process chart providing a schematic illustration of anexample embodiment of a method for forming banks example embodiments;

FIG. 2 is a cross-sectional view illustrating an example embodiment ofan organic thin film transistor structure incorporating banks formed byan example embodiment of the disclosed bank formation methods;

FIGS. 3A and 3B are cross-sectional views illustrating the patterningperformance according to an example embodiment in reproducing thephotomask sizing of FIG. 3A in the bank and source/drain electrodestructures FIG. 3B of an organic thin film transistor incorporatingbanks formed by a method according to an example embodiment,respectively;

FIG. 4 is a photograph illustrating the external shape of exampleembodiments of organic thin film transistors incorporating banks formedby a method according to an example embodiment of the disclosed methods;and

FIG. 5A is an example embodiment of an ink-jet profile corresponding toexample embodiments of organic thin film transistors incorporating banksformed by a method according to an example embodiment of the disclosedmethods, and FIG. 5B is an example embodiment of an ink-jet profilecorresponding to organic thin film transistors that do not incorporate abank according to any example embodiments.

It should be noted that these Figures are intended to illustrate thegeneral characteristics of methods and materials of certain exampleembodiments and to supplement the written description provided below.These drawings are not, however, to scale and may not precisely reflectthe precise structural characteristics of any given embodiment, andshould not be interpreted as defining or limiting the range of values orproperties encompassed by example embodiments. In particular, therelative thicknesses and positioning of layers or regions may be reducedor exaggerated for clarity. The use of similar or identical referencenumbers in the various drawings is intended to indicate the presence ofa similar or identical element or feature.

DESCRIPTION OF EXAMPLE EMBODIMENTS

Example embodiments will now be described in detail with reference tothe accompanying drawings. Example embodiments provide methods forforming banks comprising the steps of (1) coating a substrate with awater-soluble polymer solution containing a UV curing agent and awater-soluble fluorine compound, and (2) irradiating the coatedwater-soluble polymer solution with UV light by a photolithographicpatterning process, followed by a suitable developing to form a patternof banks on the substrate surface. FIG. 1 is a process chartschematically illustrating a method for forming banks according to oneembodiment of example embodiments.

The water-soluble polymer used in the method of example embodiments hasa functional group with a high affinity for water, for example, one ormore groups selected from a group including —OH, —COOH, —NH₂ and —CONH₂,within the molecular structure and includes little or no crosslinking sothat it dissolves easily in water to from an aqueous solution. The useof the water-soluble polymer solves the problem of degraded performanceof organic electronic devices, which is caused by a deterioration ofpixel regions of adjacent organic electronic devices induced when aphotoresist is used to form banks using a conventional organic solvent,and enables the formation of banks without adversely affecting pixelregions of organic electronic devices.

Suitable water-soluble polymers that may be used in a method accordingto example embodiments include polyvinyl alcohol, polyvinyl chloride,polyacryl amide, polyethylene glycol, polyethylene oxide, polymethylvinyl ether, polyethylene imine, polyphenylene vinylene, polyaniline andpolypyrrole as well as copolymers, block copolymers, and mixturesthereof. The water-soluble polymer may be further polymerized with oneor more monomers, oligomers or polymers that do not include acorresponding hydrophilic functional group, thereby rendering theminsoluble or only slightly soluble in water, to form copolymers,terpolymers and even higher order polymers. The water-soluble polymercomponent of the final polymer composition, however, should besufficient to maintain suitable solubility in water, typically at least10% by weight of the water-soluble polymer.

The UV curing agent used in the example embodiments facilitates curingof banks by UV irradiation. Examples of suitable UV curing agentsinclude ammonium dichromate, pentaerythritol triacrylate, urethaneacrylate, and mixtures thereof. The UV curing agent may be incorporatedin the aqueous solution of the water-soluble polymer in deionized waterin a quantity sufficient to establish a ratio between the UV curingagent and the water-soluble polymer in the range of 1:100 to 1:20, andmore typically, a range of 1:50 to 1:25, based on the total solids (dry)content of the composition.

The coating composition may be applied to the substrate surface usingany appropriate technique, for example, spin coating, dip coating,printing, ink-jet printing, or roll coating, suitable for forming acoating layer of sufficient thickness and uniformity. After application,the solvent content of the coating composition may be reduced by aconventional baking or drying method sufficient to produce a coatinglayer including an increased concentration of the polymer(s) andUV-curing agent(s) and thereby improve the stability of the coatinglayer before patterning the coating layer.

The UV irradiation may be performed using a lamp or other light sourcecapable of applying light energy of, for example, 300 to 500 W persquare centimeter, to the coating layer at a UV wavelength of, forexample, 340 to 400 nm for an exposure period of, for example, 10 to 180seconds to from an exposed coating layer. The exposed coating layer maythen be developed using deionized water at room temperature,approximately 25° C. for a development period, for example, 1 to 5minutes, suitable to remove portions of the coating layer, leaving apattern of banks on the substrate surface.

The method according to example embodiments may further comprise thestep of baking the pattern of banks after the developing portion hasbeen completed. The baking process may be performed on a hot plate at abake temperature of, for example, 50 to 200° C. for a bake period of,for example, 0.5 to 2 hours, to complete formation of the banks.

As noted above, in addition to the water-soluble polymer and the UVcuring agent, example embodiments of the coating composition alsoinclude at least one water-soluble fluorine compound. The inclusion ofthe water-soluble fluorine compound allows for the substantiallysimultaneous formation and surface treatment of banks, thereby avoidingor reducing the need for additional processing, for example, subsequentsurface treatment(s) used for establishing a desired contact angle withthe banks after formation of the banks.

The water-soluble fluorine compound(s) incorporated in the coatingcomposition according to example embodiments example embodimentsmodifies the hydrophilicity of the resulting banks relative to adjacentregions of the substrate, for example, a channel and thereby achieve,for example, an increased contact angle. The ratio of the water-solublefluorine compound(s) to the water-soluble polymer(s) will typically fallwithin a range of 1:10 to 1:1, based on the total solids (dry) contentof the coating composition. Examples of suitable water-soluble fluorinecompounds example embodiments include those compounds that are stable inaqueous solutions, for example, fluoroalkanes, and may include one ormore silanol groups.

Other example embodiments include organic thin film transistorscomprising a substrate, a gate electrode, a gate insulating film,source/drain electrodes, an organic semiconductor layer, and banksformed using a method corresponding to example embodiments detailedabove. There is no particular restriction regarding the structure of theorganic thin film transistors which may include, for example, one ormore structures generally categorized as bottom contact type, topcontact type and/or top gate type structures.

Example organic thin film transistors incorporating banks formed usingan example embodiment of the methods detailed above will be detailedwith respect to both bottom contact type and top gate type organic thinfilm transistors as described with reference to the accompanyingdrawings. FIG. 2 illustrates an example embodiment of a bottom contacttype organic thin film transistor. As shown in FIG. 2, the bottomcontact type organic thin film transistor comprises a substrate, a gateelectrode formed on a surface of the substrate, a gate insulating filmformed thereon, source/drain electrodes formed on the gate insulatingfilm, banks formed on the source/drain electrodes, and an organicsemiconductor layer. In an alternative structure, a top gate typeorganic thin film transistor comprises a substrate, source/drainelectrodes formed on the surface of the substrate, banks formed on thesource/drain electrodes, an organic semiconductor layer, a gateinsulating film formed on the organic semiconductor layer, and a gateelectrode.

Those skilled in the art will appreciate that while the organic thinfilm transistors illustrated in example embodiments have a structure inwhich banks are formed on source/drain electrodes, methods according toexample embodiments may be used to form banks on a wide variety ofstructures and is not, therefore, limited to the illustrated structures.

The gate insulating film incorporated in the organic thin filmtransistor according to example embodiments may be selected from a groupincluding, for example, polyvinyl phenol, polymethyl methacrylate,polyacrylate, polyvinyl alcohol, SiN_(x) (0<x<4), SiO₂, Al₂O₃, andmixtures and derivatives thereof. The organic semiconductor layer mayinclude one or more organic semiconducting materials, for example,polythiophene, polyaniline, polyacetylene, polypyrrole, polyphenylenevinylene, and mixtures and derivatives thereof The gate electrode, thesource electrode and the drain electrode may be formed from any suitableconductor including, for example, metal-based conductors includingmetals, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni),molybdenum (Mo), tungsten (W), metal oxides, for example, indium-tinoxide (ITO) and/or indium-zinc oxide (IZO), metal nitrides, metal alloysand mixtures thereof, as well as organic conductors, for example,polythiophene, polyaniline, polyacetylene, polypyrrole, polyphenylenevinylene, polyethylenedioxythiophene (PEDOT)/polystyrenesulfonate (PSS)mixtures, and combinations and mixtures thereof The substrate may beformed from any suitable material, typically an insulating orsemiconducting material, for example, glass, silicon, and plastic, andmay include combinations and mixtures thereof, but is not limited tothese materials.

A bottom contact type organic thin film transistor may be fabricated inaccord with an example embodiment of the disclosed method by (1) forminga gate electrode on a substrate; (2) forming a gate insulating film onthe gate electrode; (3) forming source/drain electrodes on the gateinsulating film; (4) forming banks on the source/drain electrodes; and(5) forming an organic semiconductor layer on the gate insulating filmand the source/drain electrodes.

Alternatively, a top gate type organic thin film transistor may befabricated in accord with an example embodiment of the disclosed methodby (1) forming source/drain electrodes on a substrate; (2) forming bankson the source/drain electrodes; (3) forming an organic semiconductorlayer between the source/drain electrodes and the substrate; (4) forminga gate insulating film on the organic semiconductor layer; and (5)forming a gate electrode on the gate insulating film.

A more detailed description of the respective steps for fabricating thebottom contact type organic thin film transistor according to exampleembodiments is provided below. As will be appreciated by those skilledin the art, the description of the steps utilized in fabricating abottom contact type organic thin film transistor according to exampleembodiments will be equally applicable to the corresponding stepsutilized in fabricating a top gate type organic thin film transistor.

(1) Formation of Gate Electrode

First, a substrate is washed or otherwise prepared in a mannersufficient to remove impurities and contamination present thereon usingany suitable or conventional method of substrate preparation. A singleor multi-layer gate electrode film is then formed on the surface of thesubstrate and then patterned to obtain a gate electrode pattern.

(2) Formation of Gate Insulating Film

A gate insulating film of sufficient thickness, uniformity anddielectric strength is then formed on the gate electrode and the exposedregions of the substrate using any suitable or conventional process. Aswill be appreciated by those skilled in the art, a variety of processesmay be utilized for forming the gate insulating film including, forexample, vacuum evaporation and solution deposition. Depending on thematerials and processes utilized, the gate insulating film may also besubjected to one or more thermal processes or “bakes” that may include,for example, a soft bake at a soft bake temperature range of about 60°C. to about 150° C. for bake period of about 1 minute to about 10minutes, and/or a hard bake at a hard bake temperature of about 100° C.to about 200° C. for a bake period of about 30 minutes to about 3 hours.

(3) Formation of Source/Drain Electrodes

Source/drain electrodes may then be formed on the gate insulating layer.Specifically, one or more layers of a suitable conductor, for example ametal, metal nitride, metal oxide, metal alloy, organic conductor orcombination thereof is deposited on the gate insulating film using anysuitable or conventional thin film formation technique(s). Thisconductive thin film may then be patterned using any suitable orconventional photolithographic process with the exposed photoresist thenbeing developed to protect those areas of the conductive film that areto become source and drain electrodes are formed and expose thoseregions of the film that will be removed to form the S/D pattern. Theconductive thin film is then etched using the S/D photoresist pattern asan etch mask using an etching technique suitable for the conductivematerial(s) present in the conductive thin film. After completing theetch process(es), the photoresist pattern may be removed using aconventional photoresist stripping method to expose the source/drainelectrodes on the gate insulating film.

Processes for the formation of the source and drain electrodes on thegate insulating film are not especially limited and may, for examples,utilize one or more methods selected from a group including vacuumevaporation, thermal evaporation, spin coating, roll coating, spraycoating and printing.

(4) Formation of Banks

Banks are then formed on the source/drain electrodes utilizing a methodcorresponding to example embodiments described above in which an aqueoussolution including at least a water-soluble polymer, a UV curing agentand a water-soluble fluorine compound is applied to the substratesurface and then patterned without the use of additional organicsolvents. In example embodiments, a qualitative measure of the degree ofcross-linking is whether it is soluble in the solvents such as toluene,tetrahydronaphthalene (THN), chlorobenzene, dichlorobenzene,trichlorobenzene, bromobenzene, cyclohexanone, methylnaphthalene, etc.,used in the printing process including ink jetting.

(5) Formation of Organic Semiconductor Layer

An organic semiconductor layer is formed by applying one or moresuitable organic semiconductor material(s) to the source/drainelectrodes and the gate insulating film using any suitable orconventional coating process. Coating processes generally consideredsuitable for depositing such organic semiconductor material include, butare not limited to, thermal evaporation, screen printing, printing, spincoating, dip coating, and ink spraying.

Example embodiments also provide for the fabrication of display devicesincorporating such organic thin film transistors. A variety of displaydevices may be manufactured in this manner including, for example,electroluminescence devices, liquid crystal devices and/orelectrophoresis devices. Example embodiments also provide for Exampleembodimentselectronic display devices incorporating such display deviceincluding, for example, displays, smart cards and inventory (RFID) tags.

Certain example embodiments are be explained in greater detail belowwith reference to the following examples. However, as will beappreciated by those skilled in the art, these examples are given forthe purpose of illustration only and are not intended to, and should notbe construed to, limit the scope of the appended claims.

EXAMPLES Example 1

A glass substrate was cleaned, and aluminum (Al) was deposited thereonusing a sputtering technique to form a gate electrode having a thicknessof about 1,500 Å. An organic gate insulating film having a thickness ofabout 4,000 Å was then formed on the gate electrode by spin coating at2,000 rpm, followed by sequential baking at 70° C. for 20 minutes and200° C. for 2 hours. As will be appreciated by those skilled in the art,the viscosity of the organic insulating material and the operation ofthe spin coating apparatus may be modified to produce layers havingdifferent thickness ranges.

Next, a layer of gold (Au) was deposited on the insulating film to athickness of 700 Å using a thermal evaporation method. This conductivelayer was then subjected to a photolithographic process to form anappropriate etch mask and then etched to produce an electrode pattern.For this example, the deposition was conducted under a vacuum pressureof 2×10⁻⁷ torr and achieved a deposition rate of about 0.85 Å/sec.

Subsequently, banks were formed on the electrodes in accordance with thefollowing procedure. The coating composition was prepared by addingammonium dichromate (Sigma Aldrich) to a 5 wt % solution of polyvinylalcohol (#2000, Kanto Chemical Co.) in deionized water to prepare anintermediate solution. (Unless otherwise indicated, all weight percent(wt %) values are based on a “dry” weight) The ammonium dichromate wasadded to the polyvinyl alcohol at a ratio of 1:33, based on the solidscontent. A fluoroalkane (Zonyl DuPont®), specifically a fluorinecompound that is stable in aqueous solutions was then added to theintermediate solution to produce an example coating composition. Theratio of the fluoroalkane to the water-soluble polymer in the coatingcomposition was 0.3:1, based on the solids content. The resultingexample coating composition, an aqueous polyvinyl alcohol solution, wasthen spin-coated on the substrate and the electrode pattern and dried toremove the majority of the solvent (water) and thereby form a coatinglayer. In example embodiments, a water-soluble fluorine compound isselected from a group consisting of fluoroalkanes and their derivatives,perfluoroalkylalcohol ethylene oxides and their derivatives,perfluoroalkylcarboxylic acids and their salts, perfluoroalkylsulfonicacids and their salts, perfluoroalkyloxybenzenesulfonic acids and theirsalts, perfluoroalkylbenzenesulfonic acids and their salts,perfluoroalkyl amine and their salts, perfluoroalkylsulfonamides andtheir salts, ammonium fluoride, monoethanolamine fluoride,tetramethylammonium fluoride, mixtures and combinations thereof.

The surface of those portions of the coating layer that will becomebanks was then irradiated using a UV lamp with a power of about 400W/cm² at a wavelength of 370 nm for an exposure time of 180 seconds. Theexposed coating layer, including the irradiated bank portions, was thendeveloped using deionized water at room temperature for a developmentperiod of 3 minutes to produce a bank pattern. The developed bankpattern was then baked on a hot plate at a bake temperature of 200° C.for a bake time of one hour. After cooling the bank pattern, an organicsemiconductor material, specifically polythiophene, was then applied toform a semiconductor active region on those portions of the electrodesand the gate insulating film exposed between the electrodes that aresurrounded by a portion of the bank pattern. In this instance, theorganic semiconductor material was applied using an ink spraying methodto form the semiconductor active layer.

Experimental Example 1

In order to evaluate the pattern ability of banks formed in a manneraccording to the example embodiments, the size of a pattern of aphotomask used and that of corresponding portions of the banks formedusing that photomask as detailed in Example 1 were measured using aconfocal laser scanning microscope (OLYMPUS LEXT OLS3000). The resultsare shown in FIGS. 3A and 3B, wherein FIG. 3A shows the size of the bankand source/drain patterns of a photomask used, and FIG. 3B shows thesize of the corresponding banks and source/drain structures formed usingthe photomask. As reflected in the close agreement between the photomaskmeasurements and the resulting pattern measurements, the method offorming banks according to example embodiments can accurately reproducethe corresponding mask feature.

FIG. 4 shows a semiconductor array produced by depositing thesemiconductor material by ink spraying after formation of the banks.

Experimental Example 2

In order to demonstrate and evaluate the use of printing methods infabricating organic thin film transistors incorporating banks, theink-jet profile of the organic thin film transistors fabricated inExample 1 was observed under an optical microscope. The results areshown in FIGS. 5A and 5B wherein FIG. 5A shows the ink-jet profile oforganic thin film transistors that did incorporate banks according toexample embodiments and FIG. 5B shows a corresponding ink-jet profile oforganic thin film transistors that did not incorporate banks accordingto example embodiments. As reflected in the micrographs, those organicthin film transistors that did not incorporate banks manufacturedaccording to example embodiments exhibited relatively non-uniformspreadability while, conversely, those organic thin film transistorsthat did incorporate banks manufactured according to example embodimentscomprising banks showed markedly more uniform spreadability.

Experimental Example 3

In order to evaluate whether organic thin film transistors according toexample embodiments alter the contact angles, the channel contact anglesfor the surface of the gate insulating film and the surface of the banksas fabricated in Example 1 were measured with the results provided belowin TABLE 1.

The contact angles were determined by advancing angle measurement usinga single drop of distilled water.

TABLE 1 Example 1 Channel  2.7° Banks 58.6°

As can be seen from the data provided in TABLE 1, the addition of thewater-soluble fluorine compound to the coating composition used to formthe banks incorporated in the organic thin film transistors according toexample embodiments altered the hydrophilicity of the banks relative tothat of a corresponding channel, thereby increasing the contact angle.

Although certain example embodiments have been described herein withreference to particular materials and structures, these exampleembodiments are not intended to, and should not be considered to, undulylimit the scope of the embodiments encompassed by the disclosure.Accordingly, those skilled in the art example embodiments willappreciate that various modifications of the structures, materials andprocesses are possible, without departing from the scope of thedisclosure defined by example embodiments.

As apparent from the foregoing, organic thin film transistors utilizingbanks formed by a method according to example embodiments, whichincludes the use of a water-soluble polymer, may improve the yield,performance and/or reliability of the resulting devices. In addition,using a coating composition including both a water-soluble polymer and awater-soluble fluorine compound provides for the substantiallysimultaneous formation and surface treatment of the resulting banks,thereby simplifying the fabrication process. Furthermore, the inclusionof the water-soluble fluorine compound alters the hydrophilicity of thebanks relative to that of the corresponding channel surfaces, therebyproviding improved control of the respective contact angles exhibited bythese surfaces.

1. A method of forming patterns on a substrate comprising: applying anaqueous solution of a water-soluble polymer, a UV curing agent and awater-soluble fluorine compound to the substrate, wherein thewater-soluble fluorine compound is a fluoroalkane containing a silanolgroup.
 2. The method of claim 1, wherein the method further comprises:forming a coating on the substrate from the aqueous solution;irradiating portions of the coating with UV light to form an exposedlayer; and developing the exposed layer with an aqueous developingcomposition to form the patterns.
 3. The method of claim 2, wherein: theirradiating of the coating includes exposing the portions of the coatingto UV radiation at an exposure energy of 300 to 500 W per squarecentimeter at a wavelength of 340 to 400 nm for an exposure period of 10to 180 seconds.
 4. The method of claim 2, wherein: the developing of theexposed layer includes treating the exposed layer with deionized waterat a developing temperature of about 25° C. for a developing period of 1to 5 minutes.
 5. The method of claim 2, further comprising: drying theaqueous solution to form the coating on the substrate; and baking thepattern.
 6. The method of claim 5, wherein: the baking of the patternincludes exposing the pattern to a bake temperature of 50 to 200° C. fora bake period of 0.5 to 2 hours.
 7. The method of claim 1, wherein: thewater-soluble fluorine compound and the water-soluble polymer arepresent in the aqueous solution at a ratio of 1:10 to 1:1, based on thesolids content.
 8. The method of claim 1, wherein: the water-solublepolymer is selected from a group consisting of polyvinyl alcohol,polyvinyl chloride, polyacryl amide, polyethylene glycol, polyethyleneoxide, polymethyl vinyl ether, polyethylene imine, polyphenylenevinylene, polyaniline, polypyrrole, mixtures thereof and copolymersthereof.
 9. The method of claim 8, wherein: the copolymer includes from10 to 99% by weight water-soluble polymer.
 10. The method of claim 1,wherein: the UV curing agent includes a compound selected from a groupconsisting of ammonium dichromate, pentaerythritol triacrylate, urethaneacrylate and mixtures thereof.
 11. The method of claim 1, wherein: theUV curing agent and the water-soluble polymer are present in the aqueoussolution at a ratio of 1:100 to 1:20, based on the solids content. 12.The method of claim 1, wherein: the applying of the aqueous solutionincludes applying the aqueous solution using a method selected from agroup consisting of spin coating, dip coating, printing, ink-jetprinting and roll coating.